ATS-12B-166-C3-R0
AI

The **ATS-12B-166-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, and FPGAs.
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### 1. Technical Specifications
Below are the primary technical parameters of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Black Anodized) |
| **Attachment Method** | pushPIN™ (Brass/Plastic pins) |
| **Thermal Resistance** | 12.30°C/W (Unducted @ 100 LFM) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 15mm |
| **Fin Style** | Straight Fin |
| **RoHS Status** | Compliant |
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### 2. Design Characteristics
#### A. maxiFLOW™ Architecture
The "maxiFLOW" design features a flared fin structure. Unlike standard square heat sinks, the fins spread outward, which maximizes the surface area and improves the airflow characteristics in congested PCB environments.
#### B. pushPIN™ Attachment System
This part utilizes the **pushPIN™** mounting mechanism. It includes:
* **Compression Springs:** Provide precise pressure to ensure optimal thermal interface contact.
* **Brass/Plastic Pins:** Secure the heat sink into pre-drilled holes on the PCB.
* **Ease of Install:** No specialized tools are required for high-volume assembly.
#### C. Thermal Interface Material (TIM)
The "R0" suffix usually indicates that the heat sink comes with a **pre-applied Thermal Interface Material** (typically a high-performance phase-change material or thermal pad) to ensure low thermal resistance between the component and the heat sink.
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### 3. Application Use Cases
The ATS-12B-166-C3-R0 is typically used in the following electronic sectors:
1. **Telecommunications:** High-speed routers and switches.
2. **Industrial PC:** Embedded controllers that require passive or forced-air cooling.
3. **Power Electronics:** Cooling MOSFETs or power modules.
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### 4. Part Number Breakdown
`ATS-12B-166-C3-R0`
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **12B:** Refers to the specific series/mounting style.
* **166:** Internal design/dimension code.
* **C3:** Blue Anodized or specific thermal coating (check specific datasheet for pigment variation).
* **R0:** Revision code and standard packaging/TIM configuration.
- ⤷
What are the specific thermal resistance values at different airflow speeds (LFM)?
- ⤷ What is the recommended PCB hole size for the pushPIN attachment?
- ⤷ Does this model support custom thermal interface materials?