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  • ATS-12B-166-C3-R0

  • AI
    The **ATS-12B-166-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary technical parameters of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Thermal Resistance** | 12.30°C/W (Unducted @ 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Fin Style** | Straight Fin | | **RoHS Status** | Compliant | --- ### 2. Design Characteristics #### A. maxiFLOW™ Architecture The "maxiFLOW" design features a flared fin structure. Unlike standard square heat sinks, the fins spread outward, which maximizes the surface area and improves the airflow characteristics in congested PCB environments. #### B. pushPIN™ Attachment System This part utilizes the **pushPIN™** mounting mechanism. It includes: * **Compression Springs:** Provide precise pressure to ensure optimal thermal interface contact. * **Brass/Plastic Pins:** Secure the heat sink into pre-drilled holes on the PCB. * **Ease of Install:** No specialized tools are required for high-volume assembly. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the heat sink comes with a **pre-applied Thermal Interface Material** (typically a high-performance phase-change material or thermal pad) to ensure low thermal resistance between the component and the heat sink. --- ### 3. Application Use Cases The ATS-12B-166-C3-R0 is typically used in the following electronic sectors: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial PC:** Embedded controllers that require passive or forced-air cooling. 3. **Power Electronics:** Cooling MOSFETs or power modules. --- ### 4. Part Number Breakdown `ATS-12B-166-C3-R0` * **ATS:** Advanced Thermal Solutions (Manufacturer). * **12B:** Refers to the specific series/mounting style. * **166:** Internal design/dimension code. * **C3:** Blue Anodized or specific thermal coating (check specific datasheet for pigment variation). * **R0:** Revision code and standard packaging/TIM configuration.
    ✨ Follow-up Questions
    • ⤷ What are the specific thermal resistance values at different airflow speeds (LFM)?
    • ⤷ What is the recommended PCB hole size for the pushPIN attachment?
    • ⤷ Does this model support custom thermal interface materials?