The **ATS-12H-85-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimension (L x W x H)** | 35mm x 35mm x 10mm | | **Thermal Resistance** | 8.91°C/W (at 200 LFM) | | **Flow Direction** | Fine Pitch (straight fin) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **12H**: Heat sink series (specific fin geometry). * **85**: Dimension/Internal sequence code. * **C2**: Material and Finish (Aluminum with Blue Anodize). * **R0**: RoHS Compliance status and revision. --- ### 3. Key Electronic Functions The ATS-12H-85-C2-R0 serves several critical roles in an electronic assembly: * **Heat Dissipation:** It increases the surface area of the component (e.g., a BGA chip), allowing the air to carry away heat more efficiently via convection. * **Thermal Protection:** By maintaining the junction temperature ($T_j$) within safe limits, it prevents thermal throttling or permanent damage to the semiconductor. * **Attachment Reliability:** The use of a push-pin mechanism provides consistent pressure against the chip, which improves the thermal interface material (TIM) performance compared to simple adhesive tapes. --- ### 4. Implementation Details #### Thermal Interface Material (TIM) The "R0" designation typically implies that a pre-applied thermal interface material (like a phase-change pad or thermal tape) is either included or specified for the base to ensure minimal thermal resistance between the chip and the aluminum. #### Airflow Requirements This heat sink is designed for **forced air cooling**. In a passive environment (no fan), its efficiency drops significantly. Engineers use the following metrics for thermal design: ```yaml Performance_Data: at_200_LFM: 8.91 C/W at_400_LFM: 4.50 C/W at_600_LFM: 3.50 C/W ```