The **ATS-13A-01-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (High Thermal Performance) | | **Finish** | Blue Anodized | | **Mounting Style** | Push Pin (Plastic) / Brass Spring | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 21.93 °C/W @ Unducted Flow | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### 2. Key Components & Construction The ATS-13A-01-C2-R0 is engineered for efficient heat dissipation in space-constrained environments: * **Heat Sink Body:** Extruded from high-quality aluminum. The blue anodized coating not only provides corrosion resistance but also slightly increases emissivity for better radiation heat transfer. * **Fin Geometry:** It features a straight-fin design, which is optimized for airflow environments where air is forced across the surface by a fan. * **Push-Pin Attachment:** This model uses a tool-less mounting system. The plastic push-pins are backed by high-tension springs to ensure constant, even pressure on the semiconductor, maximizing thermal contact. * **Thermal Interface Material (TIM):** Pre-applied **T766** phase-change material on the base reduces contact resistance between the chip surface and the heat sink. --- ### 3. Application Use Cases This specific model is commonly found in the following electronic assemblies: 1. **Networking Hardware:** Routers, switches, and modems. 2. **Industrial Controllers:** Cooling for FPGA (Field Programmable Gate Arrays) or ASICs. 3. **Power Supplies:** Managing heat for MOSFETs or voltage regulators. 4. **Embedded Computing:** Cooling processors on Single Board Computers (SBCs). --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 6.57 | | 400 (2.0 m/s) | 4.41 | | 600 (3.0 m/s) | 3.54 | | 800 (4.0 m/s) | 3.06 | ---