## Technical Overview of ATS-13A-41-C2-R0 The **ATS-13A-41-C2-R0** is a high-performance heat sink from the **Advanced Thermal Solutions (ATS)** "Blue" push-pin series. It is designed for cooling electronic components such as CPUs, GPUs, and high-power MOSFETs in space-constrained environments. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Standard) | | **Base Dimensions** | 40mm x 40mm | | **Height** | 22.9mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 10.02 °C/W (at 200 LFM) | --- ### 2. Physical Design & Construction The unit utilizes a specific design geometry to maximize surface area and airflow efficiency: * **Fins:** It features a **straight fin** configuration. This is ideal for forced convection (active cooling) where air is blown across the fins by a fan. * **Material:** Extruded aluminum is used for its excellent thermal conductivity-to-weight ratio. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** thermal phase-change material, which fills microscopic air gaps between the component and the heat sink base to improve heat transfer. --- ### 3. Attachment Mechanism (Push-Pin) One of the defining "parts" of this assembly is the mechanical mounting system: 1. **Push-Pins:** Plastic or brass pins (depending on the specific revision) that snap into pre-drilled holes on the PCB. 2. **Compression Springs:** These provide consistent pressure (Force) to ensure the base of the heat sink remains in tight contact with the chip, preventing thermal decoupling due to vibration or thermal expansion. --- ### 4. Cooling Performance (Thermal Resistance) Thermal resistance ($R_{th}$) determines how many degrees the component temperature will rise for every watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 10.02 | | 300 | 4.80 | | 400 | 3.56 | | 500 | 3.00 | --- ### 5. Common Applications * **BGA Cooling:** Ball Grid Array chips found in networking equipment. * **Power Supplies:** Heat dissipation for voltage regulators. * **Embedded Systems:** Industrial PCs where mechanical stability is required via push-pin mounting.