The **ATS-13A-76-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its electronic and mechanical specifications. --- ### 1. Technical Specifications This part belongs to the **pushPIN™** Heat Sink Assembly series, designed for high-efficiency cooling of integrated circuits (ICs) like CPUs, GPUs, or FPGAs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-13A-76-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Style** | Fine-Pitch (Straight Fin) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 11.57 °C/W (Unducted @ 100 LFM) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCB layout without interfering with surrounding components. * **Width/Length:** 25.00 mm x 25.00 mm * **Height (Fin Height):** 15.00 mm * **Pitch (Hole-to-Hole):** 30.00 mm * **Weight:** Approximately 15-20 grams (estimate based on aluminum density) --- ### 3. Thermal Performance Profile The effectiveness of the heat sink depends on the airflow (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 (0.5 m/s) | 4.42 °C/W | 11.57 °C/W | | 200 (1.0 m/s) | 3.17 °C/W | 4.48 °C/W | | 300 (1.5 m/s) | 2.71 °C/W | 3.03 °C/W | | 500 (2.5 m/s) | 2.25 °C/W | 2.22 °C/W | --- ### 4. Key Electronic Features * **Pre-Applied Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance phase-change material that ensures minimal air gaps between the chip and the aluminum base. * **Spring Attachment:** Uses a brass/plastic pushPIN and a stainless steel spring. This provides consistent pressure (load) on the electronic component to maximize heat transfer while preventing damage to the PCB. * **Fine-Pitch Design:** The "Fine-Pitch" fin structure is optimized for high-performance applications where space is limited but high surface area is required for heat dissipation. --- ### 5. Common Applications * **Network Switches:** Cooling high-speed processing chips. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or power ICs. * **Telecommunications:** 5G base station hardware.