The **ATS-13B-159-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm | | **Height** | 20mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 2.09°C/W (at 100 LFM) | | **Flow Pattern** | XC-Cut (Cross-Cut) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's features: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **13B**: Series/Revision type. * **159**: Dimensional code (indicates the 45mm x 45mm footprint). * **C2**: Thermal Interface Material (TIM). This usually indicates **T766** high-performance thermal grease pre-applied to the base. * **R0**: Version/RoHS Compliance status. --- ### 3. Key Electronic Functions While the heat sink itself is a passive mechanical part, its role in an electronic system is critical: * **Heat Dissipation:** It increases the surface area of the heat-generating component, allowing air to carry away heat more efficiently. * **XC-Cut Design:** The "Cross-Cut" fin geometry allows for air to flow from any direction, making it ideal for systems where the airflow direction is inconsistent or restricted. * **Pre-applied TIM:** The "C2" designation means the base comes with a thermal pad or grease. This fills microscopic air gaps between the component and the heat sink, significantly lowering thermal resistance. * **Mechanical Security:** The push-pin mechanism ensures constant pressure (clamping force) against the chip, which is vital for maintaining a reliable thermal connection over time. --- ### 4. Integration Requirements To use this part in a PCB design, the following hardware requirements must be met: ```text Required PCB Hole Diameter: 3.175mm (approx) Pitch between Holes: 38mm x 38mm Recommended Airflow: 100 to 800 LFM (Linear Feet per Minute) ```