The **ATS-13B-170-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heatsink** designed by Advanced Thermal Solutions (ATS). It is used to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the mechanical and thermal properties of this specific part number: | Property | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Brass, Plastic) | | **Fin Style** | Blue Anodized, Fine-pitch | | **Thermal Resistance** | 5.44°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 30.0mm x 30.0mm x 15.0mm | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Part Number Breakdown The part number is a coded string that defines the physical attributes of the heatsink: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **13B**: Part series/family. * **170**: Specific size and fin configuration code. * **C2**: Material and Finish (Aluminum / Blue Anodized). * **R0**: Revision code or specific packaging indicator. --- ### 3. Key Electronic Components While the heatsink itself is passive, its effectiveness relies on several sub-components: #### A. Thermal Interface Material (TIM) The **T766** material is pre-applied to the base. This is a phase-change or high-conductivity material that fills microscopic air gaps between the electronic component (die/lid) and the heatsink base, ensuring maximum heat transfer. #### B. Push-Pin Attachment Mechanism Instead of adhesive tapes, this model uses a mechanical **Push-Pin** system. * **Springs:** Provides a consistent "downward force" (pressure) to keep the heatsink in contact with the chip. * **Pins:** Designed to fit into standard 3.0mm holes on the Printed Circuit Board (PCB). #### C. Fin Geometry The "Fine-pitch" design increases the surface area exposed to the air. This is crucial for **forced convection** cooling (where a fan moves air across the fins) to prevent the electronic component from reaching its Thermal Design Power (TDP) limit and throttling. --- ### 4. Application Use-Case * **Target Devices:** BGAs, Chipsets, and Power Transistors. * **Environment:** High-airflow environments (servers, networking switches, industrial controllers) where mechanical stability is required over simple tape-on solutions.