The **ATS-13B-26-C2-R0** is a specific electronic cooling component, specifically a **high-performance heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The model number encodes specific physical and thermal characteristics of the device. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ Heat Sink | | **Base Material** | Aluminum (typically blue anodized) | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 14.20°C/W (at 100 LFM) | | **Attachment Method** | Push Pin (Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the allocated PCB footprint. * **Length:** 70.00 mm * **Width:** 70.00 mm * **Height:** 10.00 mm * **Hole Pattern (Spacing):** 63.00 mm --- ### 3. Key Electronic Components & Design Features #### A. The Heat Sink Body The body is constructed from high-grade aluminum. It uses a **straight-fin design**, which is optimized for airflow directed from a specific side. This allows for high-density cooling in low-profile environments. #### B. The Push Pin Mechanism Unlike adhesive-based heat sinks, the "R0" designation indicates a mechanical attachment: * **Brass Push Pins:** Provides a robust and secure connection to the PCB. * **Compression Springs:** Ensures consistent downward pressure on the electronic chip, which maximizes heat transfer efficiency. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a "Phase Change Material" that fills the microscopic air gaps between the heat sink and the electronic component, significantly reducing thermal resistance. --- ### 4. Application Use Cases The ATS-13B-26-C2-R0 is typically used for: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** High-performance computing in tight enclosures. 3. **Power Supplies:** Heat dissipation for MOSFETs or power regulators. ---