The **ATS-13E-06-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for cooling high-power semiconductors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-13E-06-C2-R0 | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 20.17°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Style** | maxiFLOW (Tapered Fin Design) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. maxiFLOW™ Fin Geometry Unlike standard straight-fin heatsinks, the maxiFLOW™ design features a spread-fin pattern. This increases the surface area and creates more turbulence in the airflow, which significantly improves heat dissipation efficiency in constrained spaces. #### B. pushPIN™ Attachment System This part utilizes a specialized mounting mechanism: - **Component:** Includes a flexible spring-loaded pin. - **Benefit:** Provides a precise and consistent pressure (load) on the electronic component (CPU/GPU/FPGA). - **Security:** Prevents the heatsink from shifting during mechanical vibration or shipping. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heatsink comes with **T766** thermal grease pre-applied to the base. This ensures maximum thermal conductivity between the electronic chip and the aluminum base by filling microscopic air gaps. --- ### 3. Application Use Cases The ATS-13E-06-C2-R0 is typically used to protect the following electronic components from overheating: * **Integrated Circuits (ICs):** High-speed processors and FPGAs. * **Power Electronics:** MOSFETs and power modules in telecommunications. * **Networking Hardware:** Switches and routers where high-density airflow is present. --- ### 4. Thermal Performance Data Performance varies based on the velocity of the air (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 20.17 | | 200 | 6.34 | | 400 | 3.52 | | 600 | 2.52 |