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  • ATS-13E-35-C2-R0

  • AI
    The **ATS-13E-35-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs by dissipating heat into the surrounding air. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the device: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Fin Style** | Fine-pitch Cross-Cut | | **Thermal Resistance** | 12.48°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | --- ### 2. Key Features * **Heat Sink Material:** Made of aluminum with a blue anodized finish for increased surface area and protection against corrosion. * **High Performance:** Features a "cross-cut" fin design which allows for multi-directional airflow, making it versatile for different system layouts. * **Pre-Applied Thermal Interface Material (TIM):** Usually comes with **T766** phase-change material or similar thermal tape/grease pre-applied to the base to ensure optimal heat transfer between the component and the sink. * **Mechanical Attachment:** Uses a push-pin mechanism with a specific hole pattern. This ensures a consistent pressure (clamping force) on the electronic chip, which is more reliable than adhesive-only methods. --- ### 3. Decoding the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: | Segment | Meaning | | :--- | :--- | | **ATS-13** | Series identifier (standard push-pin heat sink) | | **E** | Specific variation or fin density | | **35** | Footprint size (35mm x 35mm) | | **C2** | Thermal performance/Interface type (typically refers to the TIM used) | | **R0** | RoHS compliance and revision status | --- ### 4. Application Use-Cases This specific heat sink is typically found in: * **Networking Equipment:** Routers, switches, and firewalls. * **Industrial PCs:** Compact computing boards where vertical clearance is limited (10mm height). * **Consumer Electronics:** High-end audio/video processing units.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for mounting this heat sink?
    • ⤷ How does the thermal resistance change at different airflow rates (LFM)?
    • ⤷ Is it possible to replace the plastic push-pins with metal hardware?