ATS-13E-35-C2-R0
AI

The **ATS-13E-35-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs by dissipating heat into the surrounding air.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of the device:
| Property | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Base Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Fin Style** | Fine-pitch Cross-Cut |
| **Thermal Resistance** | 12.48°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 35mm x 35mm x 10mm |
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### 2. Key Features
* **Heat Sink Material:** Made of aluminum with a blue anodized finish for increased surface area and protection against corrosion.
* **High Performance:** Features a "cross-cut" fin design which allows for multi-directional airflow, making it versatile for different system layouts.
* **Pre-Applied Thermal Interface Material (TIM):** Usually comes with **T766** phase-change material or similar thermal tape/grease pre-applied to the base to ensure optimal heat transfer between the component and the sink.
* **Mechanical Attachment:** Uses a push-pin mechanism with a specific hole pattern. This ensures a consistent pressure (clamping force) on the electronic chip, which is more reliable than adhesive-only methods.
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### 3. Decoding the Part Number
The part number follows a specific nomenclature used by Advanced Thermal Solutions:
| Segment | Meaning |
| :--- | :--- |
| **ATS-13** | Series identifier (standard push-pin heat sink) |
| **E** | Specific variation or fin density |
| **35** | Footprint size (35mm x 35mm) |
| **C2** | Thermal performance/Interface type (typically refers to the TIM used) |
| **R0** | RoHS compliance and revision status |
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### 4. Application Use-Cases
This specific heat sink is typically found in:
* **Networking Equipment:** Routers, switches, and firewalls.
* **Industrial PCs:** Compact computing boards where vertical clearance is limited (10mm height).
* **Consumer Electronics:** High-end audio/video processing units.
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What are the PCB hole requirements for mounting this heat sink?
- ⤷ How does the thermal resistance change at different airflow rates (LFM)?
- ⤷ Is it possible to replace the plastic push-pins with metal hardware?