The part number **ATS-13E-65-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 45mm x 45mm x 25mm | | **Attachment Type** | Push Pin (with Spring) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~7.29 °C/W (at 100 LFM airflow) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **13E**: Series identifier (typically indicates dimensions and attachment style). * **65**: Specific model within the series. * **C2**: Indicates the material/finish (Aluminum, Blue Anodized). * **R0**: Version or revision code. --- ### 3. Key Electronic Functions While a heat sink is a mechanical part, its role in an electronic system is critical for: 1. **Thermal Management**: It increases the surface area of a heat-generating component (like an FPGA), allowing air to carry heat away more efficiently. 2. **Protection**: By maintaining low junction temperatures, it prevents **thermal throttling** (performance drops) and permanent hardware damage. 3. **Stability**: Ensures the electronic component operates within its specified temperature range to maintain signal integrity and longevity. --- ### 4. Installation and Usage The "Push Pin" system is designed to provide secure, consistent pressure on the chip. * **Springs**: Provide a specific "force" to ensure the heat sink remains in contact with the component even during vibration. * **TIM (Thermal Interface Material)**: The pre-applied T766 material fills microscopic air gaps between the chip and the heat sink to maximize heat transfer. ---