The part number **ATS-13F-45-C3-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. This specific component belongs to the **maxiFLOW™** series, designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Attachment Method** | pushPIN™ (Brass Pins / Stainless Steel Springs) | | **Thermal Resistance** | 1.51 °C/W (at 200 LFM) | | **Base Material** | Aluminum (Blue Anodized) | | **Fin Style** | maxiFLOW (Tapered Fin Design) | | **Dimensions (L x W x H)** | 37.00mm x 37.00mm x 15.00mm | | **Interface Material** | T412 (Thermal Tape / Phase Change) | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the physical and thermal properties of the unit: * **ATS-13**: Refers to the specific series/model line within the ATS catalog. * **F**: Indicates a "Fine" fin pitch (though usually associated with specific fin density). * **45**: Refers to the physical length/width category (37mm base size). * **C3**: Represents the specific thermal performance and fin height (15mm). * **R0**: Indicates the finish and compliance (usually Blue Anodized and RoHS compliant). --- ### 3. Key Features * **maxiFLOW™ Geometry:** The fins are tapered and angled to maximize surface area and improve airflow through the heatsink, significantly reducing the "pressure drop" common in standard straight-fin designs. * **pushPIN™ Mounting:** This system ensures consistent pressure between the heatsink and the electronic component, which is critical for maximizing heat transfer efficiency. * **Pre-Applied Thermal Interface Material (TIM):** Most "R0" variants come with a high-performance thermal pad or tape pre-applied to the base, simplifying the assembly process in a production environment. * **Durability:** The Blue Anodized finish prevents oxidation and increases the emissivity of the surface, further aiding in radiation cooling. --- ### 4. Typical Applications * **Networking Hardware:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Cooling MOSFETs and Power Modules. * **Consumer Electronics:** High-end set-top boxes or gaming consoles. ---