The **ATS-13G-129-C2-R0** is a high-performance electronic component specifically designed for thermal management. It belongs to the **Advanced Thermal Solutions (ATS)** "maxiFLOW" heat sink family, primarily used to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary electronic and physical specifications for this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Material** | Aluminum (Black Anodized) | | **Thermal Resistance** | 8.64°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ | | **Base Dimensions** | 54.00mm x 54.00mm | | **Height (Fin)** | 10.00mm | | **Fin Style** | XC-Cut (Cross-Cut) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. XC-Cut Fin Design Unlike standard straight-fin heat sinks, the XC-Cut pattern allows for **multidirectional airflow**. In complex electronic enclosures where air direction might be turbulent or non-linear, this design ensures efficient heat extraction regardless of the fan placement. #### B. pushPIN™ Attachment Modern electronic PCBs (Printed Circuit Boards) are fragile. This part uses a specialized pushPIN™ mechanism: * **Precision Springs:** Ensures even pressure across the electronic component to prevent cracking the silicon die. * **Brass/Plastic Pins:** Provides a secure mechanical lock into pre-drilled PCB holes (typically 3.00mm). #### C. Thermal Interface Material (T766) The part comes with **T766** pre-applied. In electronics, the air gap between a chip and a heat sink acts as an insulator. The T766 material fills these microscopic voids, significantly lowering the thermal resistance and ensuring the chip stays within its Operating Temperature Range. --- ### 3. Typical Applications This component is typically found in high-reliability electronic systems: * **Telecommunications:** High-speed routers and switches. * **Data Centers:** Server blades and storage arrays. * **Industrial Controls:** Embedded systems requiring passive or low-profile active cooling. --- ### 4. Dimensional Summary If you are designing a PCB layout, these are the critical clearances: ```text Width: 54.0 mm Length: 54.0 mm Height: 10.0 mm Pitch: 47.0 mm (Hole-to-Hole spacing) ```