The **ATS-13G-67-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for secure attachment to Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-13G-67-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 20.30 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Components & Design The "electronic parts" of this assembly consist of the physical structure and the attachment mechanism: #### A. The Heat Sink Body (Fine Pitch) * **Fin Pattern:** This model typically features a **cross-cut** or "pin fin" design, which allows for multi-directional airflow. This is critical in dense electronic enclosures where airflow direction may not be consistent. * **Material:** Made of high-grade aluminum for a balance between weight and thermal conductivity. #### B. The Push-Pin Mechanism * **Pins:** Features two brass push-pins. These are designed to go through pre-drilled holes in the PCB. * **Springs:** High-tension compression springs ensure a constant "clamping force" (pressure) between the heat sink and the electronic component (CPU, GPU, or ASIC). This prevents air gaps and ensures maximum heat transfer. #### C. Thermal Interface Material (TIM) * The **T766** material is a "phase-change" or high-performance thermal pad pre-applied to the base. When the electronic component heats up, the TIM softens to fill microscopic imperfections between the chip surface and the heat sink. --- ### 3. Applications This specific part is generally used to cool medium-sized surface-mount components, such as: * **FPGAs & ASICs:** High-speed processing chips that generate significant heat. * **Northbridge/Southbridge:** Motherboard chipsets. * **Telecommunications Gear:** Network switches and routers where vertical space (10mm height) is limited.