The **ATS-13G-69-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed specifically for cooling electronic components like CPUs, GPUs, and high-density FPGAs. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 11.31°C/W (at 1.0 m/s flow) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Thermal Interface Material (TIM)** | T766 (High Performance) | | **Flow Pattern** | Straight Fin | --- ### 2. Key Component Features #### A. Thermal Interface Material (TIM) The "R0" suffix indicates that the part comes pre-applied with **T766 thermal phase change material**. This ensures optimal heat transfer between the electronic chip and the aluminum base without requiring manual application of thermal paste. #### B. Push-Pin Attachment Instead of using adhesive tape, this model uses a spring-loaded push-pin mechanism. * **Reliability:** Provides consistent pressure on the component. * **Maintenance:** Easier to remove and reinstall compared to epoxy-based solutions. * **Stability:** Reduces the risk of the heat sink shifting during vibration or shock. #### C. Straight-Fin Geometry The vertical fin design is optimized for **forced air cooling** (environments with fans). The straight fins allow air to flow through the heat sink with minimal pressure drop, effectively stripping heat away from the surface area. --- ### 3. Applications in Electronics This part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling signal processors in networking switches. 2. **Embedded Systems:** Industrial PCs where high-heat chips are used in confined spaces. 3. **Power Electronics:** Dissipating heat from large MOSFET arrays or voltage regulators. ---