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  • ATS-13G-75-C1-R0

  • AI
    The **ATS-13G-75-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" component series, designed for cooling high-heat-generating electronic devices like CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications The part number provides specific data regarding its dimensions and material properties. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic/Brass Push Pins) | | **Base Dimensions** | 25mm x 25mm | | **Height** | 10mm | | **Pitch** | Fine Pitch (High Fin Density) | | **Thermal Resistance** | ~15.00° C/W (at 100 LFM) | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Physical Design Features The component is engineered for efficiency in compact spaces: * **Cross-Cut Fin Pattern:** The sink features a "grid" or cross-cut pattern. This allows for multi-directional airflow, making it versatile for different fan placements within a chassis. * **pushPIN™ Technology:** Unlike adhesive-based sinks, this uses a spring-loaded pin mechanism. This ensures: * Consistent pressure for better thermal interface contact. * Easy installation and removal without damaging the PCB. * **Thermal Interface Material (TIM):** Typically, these units come pre-applied with a high-performance thermal pad or grease (such as T766) on the base. --- ### 3. Application Use Cases This specific heat sink is categorized as a "Low Profile" solution, used in: 1. **Telecommunications:** Networking switches and routers where vertical space is limited. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Consumer Electronics:** Set-top boxes or high-speed storage devices (NVMe drives/controllers). --- ### 4. Thermal Performance Comparison Thermal resistance varies based on the airflow (Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.00 | | 300 (1.5 m/s) | 7.50 | | 500 (2.5 m/s) | 5.80 |
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing required on a PCB for the ATS-13G-75-C1-R0?
    • ⤷ What is the difference between the C1 and C2 versions of this part?
    • ⤷ How do I calculate the maximum power dissipation this heat sink can handle?