ATS-13G-75-C1-R0
AI

The **ATS-13G-75-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" component series, designed for cooling high-heat-generating electronic devices like CPUs, GPUs, or high-power ASICs.
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### 1. Technical Specifications
The part number provides specific data regarding its dimensions and material properties.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Plastic/Brass Push Pins) |
| **Base Dimensions** | 25mm x 25mm |
| **Height** | 10mm |
| **Pitch** | Fine Pitch (High Fin Density) |
| **Thermal Resistance** | ~15.00° C/W (at 100 LFM) |
| **Compliance** | RoHS and REACH Compliant |
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### 2. Physical Design Features
The component is engineered for efficiency in compact spaces:
* **Cross-Cut Fin Pattern:** The sink features a "grid" or cross-cut pattern. This allows for multi-directional airflow, making it versatile for different fan placements within a chassis.
* **pushPIN™ Technology:** Unlike adhesive-based sinks, this uses a spring-loaded pin mechanism. This ensures:
* Consistent pressure for better thermal interface contact.
* Easy installation and removal without damaging the PCB.
* **Thermal Interface Material (TIM):** Typically, these units come pre-applied with a high-performance thermal pad or grease (such as T766) on the base.
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### 3. Application Use Cases
This specific heat sink is categorized as a "Low Profile" solution, used in:
1. **Telecommunications:** Networking switches and routers where vertical space is limited.
2. **Embedded Systems:** Industrial PCs and controllers.
3. **Consumer Electronics:** Set-top boxes or high-speed storage devices (NVMe drives/controllers).
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### 4. Thermal Performance Comparison
Thermal resistance varies based on the airflow (Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 15.00 |
| 300 (1.5 m/s) | 7.50 |
| 500 (2.5 m/s) | 5.80 |
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What is the hole-to-hole spacing required on a PCB for the ATS-13G-75-C1-R0?
- ⤷ What is the difference between the C1 and C2 versions of this part?
- ⤷ How do I calculate the maximum power dissipation this heat sink can handle?