The **ATS-13G-82-C2-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of their "maxiFLOW™" series, designed for high-density electronic packaging where airflow is directional. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-13G-82-C2-R0 | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 30mm x 30mm x 15mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 5.21 °C/W (at 200 LFM) | | **Fin Style** | Straight (maxiFLOW™ Tapered) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Component Breakdown #### A. The maxiFLOW™ Design Unlike standard square-cut heat sinks, the "G" series features a **flared fin structure**. This design increases the surface area for radiation and convection while reducing pressure drop, making it highly efficient for systems with localized fan cooling. #### B. pushPIN™ Attachment The "R0" suffix refers to the specific attachment kit. It uses a **pushPIN™** system which includes: * **Compression Springs:** Ensure even pressure across the processor or chipset. * **Brass/Plastic Pins:** Secure the sink directly into pre-drilled holes on the PCB. * **Reliability:** This method is preferred over thermal tape for high-vibration environments (e.g., aerospace or automotive electronics). #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-performance thermal pad that fills microscopic air gaps between the component (CPU/GPU/FPGA) and the aluminum base, ensuring maximum heat transfer. --- ### 3. Common Applications This specific size and thermal rating are typically found in: * **Network Switches/Routers:** Cooling small ASICs or packet processors. * **Embedded Systems:** Industrial PCs where space is limited but heat generation is high. * **Power Supplies:** Cooling MOSFETs or voltage regulators. ---