Motore di ricerca datesheet componenti elettronici
  Italian  ▼
ALLDATASHEETIT.COM

X  

  • ATS-13H-29-C2-R0

  • AI
    The **ATS-13H-29-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number itself contains coded information regarding its size, material, and performance characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Series** | pushPIN™ HS | | **Material** | Aluminum | | **Fin Type** | Straight Fin | | **Attachment Method** | pushPIN™ (Plastic/Brass) | | **Thermal Resistance** | 7.57°C/W (at 100 LFM) | | **Finish** | Blue Anodized | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits on a Printed Circuit Board (PCB) without interfering with adjacent components. * **Length (A):** 70.00 mm * **Width (B):** 70.00 mm * **Height (C):** 20.00 mm * **Pitch (E):** 63.00 mm * **Pitch (F):** 63.00 mm --- ### 3. Key Electronic/Mechanical Features #### A. Thermal Interface Material (TIM) This model typically comes with **T766** pre-applied thermal material. The TIM is essential because it fills microscopic air gaps between the heat source and the aluminum surface, significantly improving heat transfer efficiency. #### B. pushPIN™ Attachment System Instead of using messy adhesives or complex clips, this part uses a **pushPIN™ system**. * It utilizes a spring-loaded mechanism to ensure even pressure across the component. * This prevents "tilting" of the heat sink, which could lead to hot spots on the chip. #### C. Straight Fin Design The "Straight Fin" geometry is optimized for **forced-air cooling** (systems with fans). The gaps between the fins allow air to flow through with minimal resistance, carrying heat away from the aluminum body. --- ### 4. Implementation Example If you were using this in a design, your PCB layout would require specific hole placements for the pushPINs: ```markdown PCB Layout Requirements: - Hole Diameter: 3.175 mm (0.125") - Hole Spacing: 63.00 mm x 63.00 mm - Component Height Clearance: 20.00 mm ```
    ✨ Follow-up Questions
    • ⤷ What is the difference between Blue Anodized and Black Anodized finishes in heat sinks?
    • ⤷ How do I calculate the required LFM (Linear Feet per Minute) for this heat sink?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied T766?