AI

The **ATS-13H-29-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
The part number itself contains coded information regarding its size, material, and performance characteristics.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. |
| **Series** | pushPIN™ HS |
| **Material** | Aluminum |
| **Fin Type** | Straight Fin |
| **Attachment Method** | pushPIN™ (Plastic/Brass) |
| **Thermal Resistance** | 7.57°C/W (at 100 LFM) |
| **Finish** | Blue Anodized |
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### 2. Physical Dimensions
The dimensions are critical for ensuring the part fits on a Printed Circuit Board (PCB) without interfering with adjacent components.
* **Length (A):** 70.00 mm
* **Width (B):** 70.00 mm
* **Height (C):** 20.00 mm
* **Pitch (E):** 63.00 mm
* **Pitch (F):** 63.00 mm
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### 3. Key Electronic/Mechanical Features
#### A. Thermal Interface Material (TIM)
This model typically comes with **T766** pre-applied thermal material. The TIM is essential because it fills microscopic air gaps between the heat source and the aluminum surface, significantly improving heat transfer efficiency.
#### B. pushPIN™ Attachment System
Instead of using messy adhesives or complex clips, this part uses a **pushPIN™ system**.
* It utilizes a spring-loaded mechanism to ensure even pressure across the component.
* This prevents "tilting" of the heat sink, which could lead to hot spots on the chip.
#### C. Straight Fin Design
The "Straight Fin" geometry is optimized for **forced-air cooling** (systems with fans). The gaps between the fins allow air to flow through with minimal resistance, carrying heat away from the aluminum body.
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### 4. Implementation Example
If you were using this in a design, your PCB layout would require specific hole placements for the pushPINs:
```markdown
PCB Layout Requirements:
- Hole Diameter: 3.175 mm (0.125")
- Hole Spacing: 63.00 mm x 63.00 mm
- Component Height Clearance: 20.00 mm
```
- ⤷
What is the difference between Blue Anodized and Black Anodized finishes in heat sinks?
- ⤷ How do I calculate the required LFM (Linear Feet per Minute) for this heat sink?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied T766?