The **ATS-13H-67-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.00mm | | **Fin Type** | Straight | | **Fin Pitch** | Fine | | **Thermal Resistance (Unducted)** | 20.39 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 3.35 °C/W @ 100 LFM | --- ### 2. Component Breakdown #### A. The pushPIN™ Attachment System Unlike adhesive tapes or simple clips, the "13H" designation indicates a specific attachment mechanism: * **Hardware:** It utilizes a brass or plastic pin with a stainless steel spring. * **Reliability:** This provides consistent pressure (TIM - Thermal Interface Material compression) across the heat source, which is critical for preventing "hot spots." #### B. Fin Design and Airflow * **Low Profile:** At only 12mm high, this part is ideal for high-density applications like 1U servers or compact embedded systems. * **Straight Fin Pattern:** This design is optimized for environments where there is a clear, directional path for airflow (ducted or forced air). #### C. Thermal Performance The performance of this heat sink is highly dependent on the Airflow (Measured in Linear Feet per Minute - LFM): * **Low Airflow (100 LFM):** 20.39 °C/W (Higher resistance). * **High Airflow (700 LFM):** ~1.82 °C/W (Significant cooling efficiency). --- ### 3. Part Number Decoder Understanding the "ATS-13H-67-C2-R0" nomenclature: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **13:** Series/Attachment type (pushPIN™). * **H:** Spring type/Pressure rating. * **67:** Specific dimension/fin geometry profile. * **C2:** Material/Finish (Aluminum / Blue Anodized). * **R0:** Revision code. --- ### 4. Typical Applications * **Telecommunications:** Cooling of high-speed networking chips. * **Industrial PCs:** Compact motherboards where vertical space is limited. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.