The **ATS-13H-96-C2-R0** is a specific high-performance electronic thermal management component. Specifically, it is a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS) designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Attachment Type** | Push-pin (Spring-loaded) | | **Thermal Resistance** | 5.63°C/W (at 1.0 m/s airflow) | --- ### ### Key Electronic Design Features #### 1. Heat Dissipation Efficiency The "C2" in the part number indicates the material type and thermal performance level. This heat sink uses a **straight fin** design which maximizes surface area for convective cooling. In electronics, keeping the junction temperature ($T_j$) low is critical for preventing thermal throttling and extending component lifespan. #### 2. Mounting Mechanism (pushPIN™) This part utilizes a push-pin attachment system. This is a crucial "electronic part" feature because: * **Constant Pressure:** It ensures the heat sink maintains firm, even contact with the processor or PCB. * **Ease of Assembly:** It allows for rapid installation on high-density PCBs without the need for complex mounting brackets. * **Pre-installed Springs:** These provide the necessary force to compress thermal interface materials (TIM). #### 3. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Not only aesthetic; the anodization protects the aluminum from corrosion and slightly improves the emissivity of the surface for radiative heat transfer. --- ### ### Application in Circuit Design In an electronic circuit, the ATS-13H-96-C2-R0 acts as the primary passive cooling element. Engineers select this part based on the **Thermal Resistance** required to keep a component's temperature below its maximum rating given a specific air flow (measured in Linear Feet per Minute or LFM). ---