The **ATS-13H-98-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The part number provides specific data regarding its dimensions, thermal resistance, and mounting style. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height (Fin)** | 20.00 mm | | **Pitch** | Fine Pitch | | **Pattern** | Cross-Cut | --- ## 2. Thermal Performance Data Thermal resistance determines how effectively the part moves heat away from the electronic component. It is measured in degrees Celsius per Watt (°C/W) based on airflow (LFM - Linear Feet per Minute). | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) | | :--- | :--- | :--- | | 100 (0.5 m/s) | 15.31 °C/W | 2.34 °C/W | | 200 (1.0 m/s) | 5.81 °C/W | 1.74 °C/W | | 400 (2.0 m/s) | 3.20 °C/W | 1.35 °C/W | | 600 (3.0 m/s) | 2.33 °C/W | 1.16 °C/W | --- ## 3. Key Electronic Design Components ### A. The Heat Sink Body The "Cross-Cut" design allows for multi-directional airflow. This is critical in electronics where the fan might not be aligned perfectly with the fins, or where airflow is turbulent inside a chassis. ### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or simple clips, this part uses a **pushPIN™** system which includes: * **Brass/Steel Pins:** To secure the sink to the PCB. * **Compression Springs:** These provide precise "force-on-die" pressure, ensuring optimal contact with the electronic component without cracking the silicon. ### C. Thermal Interface Material (TIM) The **-R0** suffix indicates the specific revision and typically implies that the unit comes with a pre-applied **Thermal Interface Material**. This is the conductive layer (usually a pad or paste) that fills microscopic air gaps between the component and the heat sink. --- ## 4. Part Number Breakdown * **ATS**: Advanced Thermal Solutions (Manufacturer) * **13**: Series/Style * **H**: High Profile * **98**: Fin Design/Pattern ID * **C2**: Aluminum material with Blue Anodized finish * **R0**: RoHS Compliant / Revision code ---