The part number **ATS-14D-159-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The part number is an alphanumeric code that describes the physical and thermal properties of the heat sink. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push Pin (Brass) with Compression Spring | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 10mm (Low Profile) | | **Fin Style** | XC-Cut (Cross-cut) | | **Thermal Resistance** | 10.70 °C/W (at 200 LFM) | | **Interface Material** | T766 (Thermal Tape / Phase Change Material) | --- ### 2. Breakdown of the Part Number To understand the electronic application, we can decode the ATS nomenclature: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **14**: Refers to the "push pin" attachment series. * **D**: Indicates the spring type (typically a specific tension level). * **159**: The specific dimension and fin pattern identifier. * **C2**: Color and Material code (usually Blue Anodized Aluminum). * **R0**: RoHS compliance status. --- ### 3. Key Electronic Components This part is not an "active" electronic component (like a transistor) but a "passive" thermal management component. Its design includes: #### A. Thermal Interface Material (TIM) The base comes pre-applied with **T766**. This is a critical chemical layer that fills microscopic air gaps between the electronic chip (heat source) and the aluminum base of the heat sink to ensure maximum heat transfer. #### B. Push Pin & Spring Mechanism The **R0** version utilizes a brass push pin and a steel spring. This provides a specific "clamping force" (measured in PSI) required to keep the heat sink flush against the PCB without cracking the delicate silicon die of the chip. #### C. Cross-Cut (XC) Fin Design Unlike straight fins, the cross-cut design allows for **multi-directional airflow**. This is essential in crowded electronic enclosures where air may not be blowing in a single, predictable direction. --- ### 4. Application Use Cases This specific heat sink is typically found in: 1. **Network Switches**: Cooling high-speed processing chips. 2. **Embedded Systems**: Small form-factor industrial PCs. 3. **Power Supplies**: Dissipating heat from MOSFETs or voltage regulators.