The **ATS-14F-62-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling electronic integrated circuits (ICs). --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-14F-62-C2-R0 | | **Heat Sink Type** | Push-Pin / High Performance | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 16.48°C/W (at 100 LFM) to 2.21°C/W (at 700 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Features * **XC (Cross-Cut) Fin Pattern:** This design features a "straight-fin" profile that has been cross-cut into rectangular pins. This increases surface area and allows for multi-directional airflow, making it effective in systems where the direction of the fan intake might vary. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin mechanism. This provides consistent pressure for maximum heat transfer and allows for secure mounting to the PCB through pre-drilled holes. * **Thermal Interface Material (TIM):** The unit comes with **T766** pre-applied. This is a high-performance thermal grease that fills microscopic air gaps between the component and the heat sink. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization process increases the surface emissivity, which helps slightly with radiative heat transfer and protects the aluminum from corrosion. --- ### 3. Thermal Performance Profile Thermal resistance varies based on the Airflow Velocity (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 16.48 | | 300 (Unducted) | 6.54 | | 500 (Unducted) | 3.86 | | 700 (Unducted) | 2.21 | --- ### 4. Common Applications * **CPUs/GPUs:** Small form factor processors. * **ASICs and FPGAs:** High-speed integrated circuits used in networking or crypto-mining. * **Power Supplies:** Cooling voltage regulators or power transistors. * **Telecommunications:** Cooling line cards and routers.