The **ATS-14H-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 20.00mm | | **Attachment Type** | Push-Pin (Brass/Plastic) | | **Thermal Resistance** | 1.60°C/W (at 200 LFM) | --- ### 2. Key Component Features #### **A. pushPIN™ Attachment System** This part utilizes a standardized push-pin mechanism. This allows for: * **Tool-less Installation:** Quick assembly onto a Printed Circuit Board (PCB). * **Consistent Pressure:** Pre-assembled springs ensure the base of the heat sink maintains optimal contact pressure with the chip, maximizing heat transfer. #### **B. Fin Design (High Flow)** The "83" in the part number refers to a specific fin pattern. ATS heat sinks typically use a **Straight Fin** or **Cross-Cut** design depending on the flow requirement. The design is optimized for "High Flow" environments where forced air (fans) is present. #### **C. Material & Thermal Interface** * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Thermal Interface Material (TIM):** This part usually comes with **T766** pre-applied. This is a "Phase Change" material that melts at operating temperatures to fill microscopic air gaps between the heat sink and the component. --- ### 3. Part Number Breakdown (Nomenclature) To understand the specific configuration of `ATS-14H-83-C2-R0`: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **14:** Indicates the specific series/style. * **H:** High-performance thermal characteristic. * **83:** The specific fin pattern/geometry. * **C2:** Refers to the thermal interface material (TIM) and color (Blue). * **R0:** Revision/Packaging code. --- ### 4. Application Use Cases * **Embedded Systems:** Cooling microprocessors in industrial PCs. * **Telecommunications:** Dissipating heat from high-speed networking chips. * **Power Electronics:** Managing heat for VRMs (Voltage Regulator Modules).