### Overview: ATS-15A-72-C2-R0 The **ATS-15A-72-C2-R0** is a high-performance **Heat Sink** assembly manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling electronic components such as processors, FPGAs, and ASICs in high-airflow environments. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body) | | **Finish** | Blue Anodized | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | 1.80°C/W @ 200 LFM | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Thermal Interface Material** | T766 (Pre-applied) | | **RoHS Status** | Compliant | --- ### 2. Key Component Parts & Design #### A. The Heat Sink Body (maxiFLOW™) * **Geometry:** It features a unique flared fin design. Unlike traditional straight-fin sinks, the flared fins maximize the surface area for convection while minimizing pressure drop. * **Material:** Extruded aluminum offers high thermal conductivity while remaining lightweight. The blue anodized coating prevents corrosion and increases surface emissivity. #### B. The maxiGRIP™ Attachment System This is the mechanical assembly that secures the sink to the electronic component (e.g., a BGA chip). 1. **Plastic Frame Clip:** A high-strength plastic frame that snaps around the perimeter of the component. This avoids the need to drill holes in the PCB. 2. **Steady-Spring:** A gold-colored stainless steel spring clip that applies uniform pressure across the heat sink, ensuring consistent contact with the chip. #### C. Thermal Interface Material (TIM) * The unit comes with **Chomerics T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink base and the electronic chip to facilitate efficient heat transfer. --- ### 3. Application Use-Case This part is typically found in: * **Networking Gear:** Switches and routers where high airflow is present. * **Industrial Computing:** Cooling high-power logic devices. * **Power Supplies:** Managing heat for MOSFETs or power modules. ---