ATS-15B-159-C2-R0
AI

The **ATS-15B-159-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed for cooling integrated circuits (ICs), CPUs, or high-power electronic components.
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### 1. Technical Specifications
This part belongs to the **push-pin** series from Advanced Thermal Solutions (ATS). Below are the primary technical parameters:
| Property | Value |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions** | 45mm x 45mm x 10mm |
| **Thermal Resistance** | 10.70°C/W (at 200 LFM) |
| **Attachment Type** | Push-Pin (Plastic/Brass) |
| **Interface Material** | T766 (Phase Change Material) |
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### 2. Physical Design & Features
The design focuses on maximizing surface area while maintaining a low profile for height-restricted applications.
* **Fin Style:** It utilizes **Straight Fins**, which are ideal for unidirectional airflow (forced convection).
* **Base & Pins:** The "B" in the part number denotes a specific mounting hole pattern and pin style. The push-pin mechanism provides a consistent spring force for reliable thermal contact.
* **Thermal Interface Material (TIM):** The **C2** designation indicates it comes pre-applied with a Phase Change Material (T766), which softens at operating temperatures to fill microscopic air gaps between the component and the heat sink.
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### 3. Electronic Application
This part is commonly used in the following electronic environments:
1. **Networking Hardware:** Cooling ASICs or FPGAs in switches and routers.
2. **Embedded Systems:** High-speed processors that generate significant heat in compact enclosures.
3. **Power Electronics:** Dissipating heat from MOSFETs or power regulators.
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### 4. Thermal Performance Data
Performance varies based on the Airflow (LFM - Linear Feet per Minute):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **200 (1.0 m/s)** | 10.70 |
| **400 (2.0 m/s)** | 5.60 |
| **600 (3.0 m/s)** | 4.10 |
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- ⤷What are the specific hole patterns required for this push-pin mounting?
- ⤷ How does Blue Anodized finish affect the thermal performance compared to Black Anodized?
- ⤷ Can the T766 thermal interface material be replaced with standard thermal paste?