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  • ATS-15B-159-C2-R0

  • AI
    The **ATS-15B-159-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed for cooling integrated circuits (ICs), CPUs, or high-power electronic components. --- ### 1. Technical Specifications This part belongs to the **push-pin** series from Advanced Thermal Solutions (ATS). Below are the primary technical parameters: | Property | Value | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 10mm | | **Thermal Resistance** | 10.70°C/W (at 200 LFM) | | **Attachment Type** | Push-Pin (Plastic/Brass) | | **Interface Material** | T766 (Phase Change Material) | --- ### 2. Physical Design & Features The design focuses on maximizing surface area while maintaining a low profile for height-restricted applications. * **Fin Style:** It utilizes **Straight Fins**, which are ideal for unidirectional airflow (forced convection). * **Base & Pins:** The "B" in the part number denotes a specific mounting hole pattern and pin style. The push-pin mechanism provides a consistent spring force for reliable thermal contact. * **Thermal Interface Material (TIM):** The **C2** designation indicates it comes pre-applied with a Phase Change Material (T766), which softens at operating temperatures to fill microscopic air gaps between the component and the heat sink. --- ### 3. Electronic Application This part is commonly used in the following electronic environments: 1. **Networking Hardware:** Cooling ASICs or FPGAs in switches and routers. 2. **Embedded Systems:** High-speed processors that generate significant heat in compact enclosures. 3. **Power Electronics:** Dissipating heat from MOSFETs or power regulators. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 10.70 | | **400 (2.0 m/s)** | 5.60 | | **600 (3.0 m/s)** | 4.10 | ---
    ✨ Follow-up Questions
    • ⤷What are the specific hole patterns required for this push-pin mounting?
    • ⤷ How does Blue Anodized finish affect the thermal performance compared to Black Anodized?
    • ⤷ Can the T766 thermal interface material be replaced with standard thermal paste?