The **ATS-15B-32-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Key Technical Specifications The part number itself contains encoded information about its dimensions, material, and thermal performance. | Specification | Value | Details | | :--- | :--- | :--- | | **Part Number** | ATS-15B-32-C2-R0 | Standard Product Series | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface emissivity and provides corrosion resistance | | **Attachment Type** | Push-Pin | Spring-loaded plastic or metal pins for secure mounting | | **Dimensions** | 54mm x 54mm x 12.7mm | Large surface area, low profile (L x W x H) | | **Thermal Resistance** | 21.46 °C/W (Natural Convection) | Efficiency improves significantly with airflow | | **Thermal Interface** | T766 | Pre-applied Phase Change Material (PCM) | --- ### 2. Breakdown of the Part Number Electronic engineers use this nomenclature to identify specific mounting and cooling requirements: - **ATS-15**: The series family (Push-Pin Heat Sink). - **B**: Specific revision or manufacturing batch indicator. - **32**: Designates the specific fin pattern and height configuration. - **C2**: Refers to the **Blue Anodized** finish. - **R0**: Indicates the product is RoHS (Restriction of Hazardous Substances) compliant. --- ### 3. Application and Usage This heat sink is intended for PCB-level cooling where mechanical stability is critical. * **Mounting Mechanism:** It uses a push-pin and compression spring system. This ensures even pressure across the component (like a processor), which optimizes heat transfer through the Thermal Interface Material (TIM). * **Fin Design:** It typically features a **Straight Fin** or **Cross-Cut** design. This allows air to move through the fins via forced convection (fans) or natural convection. * **Target Components:** Common in industrial PCs, networking switches, and telecommunications equipment where heat must be moved away from high-power surface-mount devices. --- ### 4. Thermal Performance Data Performance varies based on the velocity of the air moving across the fins: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 11.77 | | **400 (2.0 m/s)** | 6.46 | | **600 (3.0 m/s)** | 4.48 | ---