The **ATS-15D-209-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic integrated circuits (ICs). --- ### 1. Technical Specifications The following table outlines the key physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 70.00 mm x 70.00 mm | | **Height (Fin)** | 10.00 mm | | **Pitch** | Fine-Pitch | | **Thermal Resistance** | 6.27°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Design Characteristics The part number can be broken down to understand its structural features: * **Heat Sink Profile:** It features a **Straight-Fin** design. This is optimized for systems with a specific direction of airflow, providing a large surface area for heat dissipation while maintaining a low profile (10mm). * **Thermal Interface Material (TIM):** The "C2" suffix typically indicates that the part comes pre-applied with **T766** thermal grease, which ensures high conductivity between the heat source (CPU/GPU) and the aluminum base. * **Attachment Mechanism:** It uses a pushPIN™ system consisting of a brass or plastic pin and a stainless steel spring. This provides: * **Consistent Pressure:** Ensures the heat sink stays flat against the component. * **Easy Installation:** Requires pre-drilled holes in the PCB. --- ### 3. Application and Usage This component is primarily used in environments where vertical space is limited but horizontal surface area is available. * **Common Use Cases:** Networking switches, telecommunications equipment, and high-speed computing blades. * **Efficiency:** The "Fine-Pitch" fin pattern is most effective in forced-air environments (systems with active cooling fans). --- ### 4. Thermal Performance Comparison Thermal resistance decreases as the velocity of airflow (measured in Linear Feet per Minute - LFM) increases: | Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance (Unducted)** | 6.27 °C/W | 3.46 °C/W | 2.59 °C/W |