ATS-15E-41-C2-R0
AI

The **ATS-15E-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs) like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 40mm x 40mm x 25mm |
| **Fin Style** | Straight Fin |
| **Attachment Type** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 10.03 °C/W @ 100 LFM |
| **Flow Pattern** | Square / Omnidirectional |
| **Compliance** | RoHS and REACH Compliant |
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### 2. Key Components & Features
#### A. Thermal Interface Material (TIM)
* **Part Suffix (-R0):** Indicates that the heatsink comes pre-applied with **T766** thermal phase change material.
* **Function:** This ensures maximum heat transfer between the electronic component (heat source) and the aluminum base by filling microscopic air gaps.
#### B. Attachment Mechanism (pushPIN™)
* The assembly uses a **brass push-pin** with a **stainless steel spring**.
* **Benefits:** It provides consistent pressure (load) to the component, preventing damage while ensuring optimal thermal contact.
#### C. Fin Design
* The **Straight Fin** geometry is optimized for vertical or horizontal airflow.
* The 25mm height offers a large surface area for heat dissipation without creating excessive "shrouding" or blocking nearby components on the PCB.
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### 3. Thermal Performance Data
Performance varies based on the airflow velocity (measured in Linear Feet per Minute - LFM):
| Velocity (LFM) | Thermal Resistance (Unducted) |
| :--- | :--- |
| 100 (0.5 m/s) | 10.03 °C/W |
| 300 (1.5 m/s) | 3.65 °C/W |
| 500 (2.5 m/s) | 2.37 °C/W |
| 700 (3.5 m/s) | 1.85 °C/W |
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### 4. Part Number Breakdown
The nomenclature follows this specific logic:
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **15:** pushPIN™ Series
* **E:** Hardware version/Material type
* **41:** Length/Width dimension (approx. 40mm)
* **C2:** Material/Fin height code (25mm)
* **R0:** Final revision and TIM type
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What is the hole pattern required on a PCB for this pushPIN attachment?
- ⤷ Can this heatsink be used for passive cooling without a fan?
- ⤷ How does the T766 thermal material compare to standard thermal grease?