The **ATS-15F-01-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of the "push-pin" series designed for cooling electronic components like CPUs, GPUs, and other high-heat-generating ICs. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-15F-01-C3-R0 | | **Heat Sink Type** | Push-pin style | | **Material** | Aluminum (with Blue Anodized finish) | | **Thermal Resistance** | 22.05°C/W (undirected flow) | | **Dimensions** | 40mm x 40mm x 6mm | | **Mounting Type** | Plastic Push-Pin with Brass Springs | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### Key Components & Design Features #### 1. Heat Sink Body (Aluminum) The core component is made of extruded aluminum. The low profile (6mm height) is specifically designed for space-constrained environments where vertical clearance is limited. The blue anodized finish increases corrosion resistance and emissivity. #### 2. Fin Configuration The "01" in the part number indicates a specific fin pattern. These fins increase the surface area available for heat dissipation. Because it is a low-profile sink, it relies heavily on airflow from nearby fans. #### 3. Attachment Mechanism (Push-Pin) Instead of adhesive tape or screws, this part uses: * **Plastic Push-Pins:** These snap into pre-drilled holes in the PCB. * **Compression Springs:** These ensure constant pressure between the heat sink and the component, optimizing thermal transfer. #### 4. Thermal Interface Material (T412) The "R0" suffix often denotes the inclusion of a pre-applied **Thermal Interface Material (TIM)**. In this case, it uses **T412**, which is a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink. --- ### Application Usage * **Embedded Systems:** Ideal for cooling small processors in industrial computers. * **Networking Gear:** Used on switches and routers for ASIC cooling. * **Power Electronics:** Applied to MOSFETs or voltage regulators that require moderate heat dissipation. ---