The **ATS-15F-02-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to their **pushPIN™** series. --- ## 1. Technical Specifications The part is designed for high-density electronic cooling applications where space is limited but thermal dissipation requirements are high. | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-15F-02-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ | | **Fin Style** | Straight | | **Fin Pitch** | Fine | | **Thermal Resistance** | 18.32° C/W (at 100 LFM) | | **Dimension (Length x Width)** | 40.00 mm x 40.00 mm | | **Height** | 12.70 mm | --- ## 2. Key Features and Components ### A. Material & Finish * **AL6063 Aluminum:** Chosen for its excellent thermal conductivity and structural integrity. * **Blue Anodized Coating:** Provides corrosion resistance and increases surface emissivity, slightly improving radiant heat transfer. ### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or complex screws, this part uses a **pushPIN™** mechanism: * **Spring-loaded mechanism:** Ensures consistent pressure (preload) between the heat sink and the component (like a CPU or FPGA). * **Reliability:** Prevents the heat sink from shifting during vibration or shipping. ### C. Thermal Interface Material (TIM) * **Type:** Pre-applied **T766** phase-change material. * **Benefit:** Eliminates the need for manual thermal paste application, ensuring an even and efficient thermal path between the chip and the aluminum base. --- ## 3. Performance Data (Airflow) The efficiency of this heat sink varies significantly based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM). | Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 18.32 | | 200 | 1.0 | 7.15 | | 300 | 1.5 | 4.12 | | 400 | 2.0 | 3.11 | --- ## 4. Typical Applications This specific model is often found in: * **Networking Equipment:** Routers, switches, and small servers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or small power modules.