The **ATS-15F-03-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of the "push pin" series designed for cooling surface-mount components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-15F-03-C2-R0 | | **Heat Sink Type** | XCUT (Cross-Cut) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | ~15.85°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm | --- ### 2. Key Components & Design Features #### A. The Fin Design (XCUT) The "XCUT" geometry features a straight fin pattern that has been cross-cut. This design is highly efficient because: * It allows for **multi-directional airflow**, meaning the air can enter from any side. * It increases the surface area for heat dissipation without significantly increasing the footprint. #### B. The Push-Pin Attachment The `-R0` suffix often denotes the specific attachment kit. This model uses **Brass Push-Pins** with steel springs. * **Springs:** Provide "firm" and "consistent" pressure (preload) to ensure maximum contact between the chip and the heatsink. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** phase-change material or similar, which fills microscopic air gaps between the component and the heatsink. #### C. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides corrosion resistance and increases surface emissivity, which slightly improves radiative cooling. --- ### 3. Usage Context This part is typically used in industrial electronics where reliability is critical. Common applications include: * **Telecommunications:** Cooling high-speed processors in switches. * **Embedded Systems:** On-board single-board computers (SBCs). * **Power Supplies:** Heat dissipation for MOSFET arrays or voltage regulators. ---