The **ATS-15F-06-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **push-PIN™** series, designed for efficient heat dissipation from integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below is a breakdown of the primary physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | push-PIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 10.00mm | | **Pitch (Mounting Hole)** | 38.00mm | | **Thermal Resistance** | 20.27 °C/W (Unducted Flow @ 100 LFM) | | **Fin Pattern** | Fine Pitch (Straight Fin) | --- ### 2. Component Composition This part is not a single piece of metal; it is an assembly consisting of three main electronic packaging elements: 1. **The Heat Sink Body:** Extruded aluminum with a high surface area to volume ratio, optimized for air cooling. 2. **Push-PINs:** Specialized fasteners that provide the necessary pressure to ensure the heat sink stays in contact with the component. 3. **Compression Springs:** These maintain constant pressure over time, even during thermal expansion or mechanical vibration, preventing "gap formation" between the chip and the cooler. --- ### 3. Thermal Interface Material (TIM) The **C3** designation in the part number typically refers to the pre-applied Thermal Interface Material. * **Material:** ATS uses a high-performance phase-change material or thermal grease. * **Purpose:** It fills the microscopic air gaps between the heat sink base and the electronic chip (CPU, GPU, or ASIC) to maximize heat transfer. --- ### 4. Application Use Cases The ATS-15F-06-C3-R0 is commonly used in environments where space is limited but heat density is high: * **Telecommunications:** Network switches and routers. * **Computing:** Embedded systems and industrial motherboards. * **Power Electronics:** Cooling MOSFETs or power conversion modules. ---