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  • ATS-15F-09-C2-R0

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    The **ATS-15F-09-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series and is designed for cooling electronic components, primarily integrated circuits (ICs) and CPUs. ### 1. General Specifications Below are the primary mechanical and thermal characteristics: | Property | Value | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-15F-09-C2-R0 | | **Fin Type** | XCUT (Cross-cut) | | **Material** | Aluminum (AL6063) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 10.58 °C/W (at 100 LFM) | | **Finish** | Blue Anodized | --- ### 2. Physical Dimensions Precision measurements are critical for PCB clearance and component fit. * **Size (L x W):** 45mm x 45mm * **Height:** 20mm * **Hole Pattern:** 38mm x 38mm * **Pin/Spring Type:** Brass/Steel (typically) --- ### 3. Key Electronic Cooling Features #### A. XCUT Fin Profile The heat sink utilizes a **cross-cut (XCUT)** fin design. Unlike standard straight fins, cross-cutting allows for: * **Multi-directional airflow:** It performs well regardless of which direction the fan is blowing. * **Increased Surface Area:** Maximizes heat dissipation in a compact footprint. #### B. Thermal Interface Material (TIM) This specific part number comes pre-applied with **T766 thermal phase change material**. * This ensures optimal thermal contact between the heat sink base and the electronic component (e.g., a BGA or FPGA). * It eliminates the need for applying external thermal paste manually. #### C. PushPIN™ Attachment System Instead of using messy adhesives or fragile clips, this part uses a **spring-loaded pushPIN** mechanism. * **Pressure Consistency:** Provides uniform pressure across the component to ensure maximum heat transfer. * **Reliability:** Resistant to high-vibration environments, making it suitable for industrial or aerospace electronics. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Resistance (°C/W) - Unducted | Resistance (°C/W) - Ducted | | :--- | :--- | :--- | | 100 | 10.58 | 2.52 | | 200 | 3.62 | 2.02 | | 400 | 2.15 | 1.59 | | 600 | 1.66 | 1.35 | ---
    ✨ Follow-up Questions
    • ⤷ What are the benefits of using a cross-cut (XCUT) fin design over a straight fin design?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?
    • ⤷ What are the PCB hole requirements for the pushPIN attachment system?