ATS-15F-09-C2-R0
AI

The **ATS-15F-09-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series and is designed for cooling electronic components, primarily integrated circuits (ICs) and CPUs.
### 1. General Specifications
Below are the primary mechanical and thermal characteristics:
| Property | Value |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-15F-09-C2-R0 |
| **Fin Type** | XCUT (Cross-cut) |
| **Material** | Aluminum (AL6063) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 10.58 °C/W (at 100 LFM) |
| **Finish** | Blue Anodized |
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### 2. Physical Dimensions
Precision measurements are critical for PCB clearance and component fit.
* **Size (L x W):** 45mm x 45mm
* **Height:** 20mm
* **Hole Pattern:** 38mm x 38mm
* **Pin/Spring Type:** Brass/Steel (typically)
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### 3. Key Electronic Cooling Features
#### A. XCUT Fin Profile
The heat sink utilizes a **cross-cut (XCUT)** fin design. Unlike standard straight fins, cross-cutting allows for:
* **Multi-directional airflow:** It performs well regardless of which direction the fan is blowing.
* **Increased Surface Area:** Maximizes heat dissipation in a compact footprint.
#### B. Thermal Interface Material (TIM)
This specific part number comes pre-applied with **T766 thermal phase change material**.
* This ensures optimal thermal contact between the heat sink base and the electronic component (e.g., a BGA or FPGA).
* It eliminates the need for applying external thermal paste manually.
#### C. PushPIN™ Attachment System
Instead of using messy adhesives or fragile clips, this part uses a **spring-loaded pushPIN** mechanism.
* **Pressure Consistency:** Provides uniform pressure across the component to ensure maximum heat transfer.
* **Reliability:** Resistant to high-vibration environments, making it suitable for industrial or aerospace electronics.
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### 4. Thermal Performance Data
Performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM):
| Velocity (LFM) | Resistance (°C/W) - Unducted | Resistance (°C/W) - Ducted |
| :--- | :--- | :--- |
| 100 | 10.58 | 2.52 |
| 200 | 3.62 | 2.02 |
| 400 | 2.15 | 1.59 |
| 600 | 1.66 | 1.35 |
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- ⤷
What are the benefits of using a cross-cut (XCUT) fin design over a straight fin design?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?
- ⤷ What are the PCB hole requirements for the pushPIN attachment system?