The **ATS-15F-61-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the "push-pin" series designed for cooling processors and other surface-mount components. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 4.97°C/W @ 100 LFM (Airflow) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Fin Type** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Breakdown #### A. Fin Profile (Straight Fin) The "Straight Fin" design is optimized for environments with consistent airflow. The gaps between the fins allow air to pass through easily, stripping heat away from the aluminum surface. At a low height of 10mm, this is considered a **Low Profile** solution, ideal for compact enclosures or 1U servers. #### B. Attachment: Push-Pin & Spring Instead of using messy adhesives or permanent solder, this part uses a mechanical **Push-Pin** system. * **Ease of Use:** Allows for quick installation and removal during maintenance. * **Pressure:** The integrated springs provide consistent downward pressure, ensuring the Thermal Interface Material (TIM) makes perfect contact with the chip. #### C. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** This is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance. #### D. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a high-performance phase-change material or thermal pad that fills microscopic air gaps between the heat source (the CPU/GPU) and the heat sink base to maximize heat transfer. --- ### 3. Applications This part is typically used in the following electronic sectors: * **Telecommunications:** Cooling for high-speed routers and switches. * **Computing:** Northbridge/Southbridge chipsets on motherboards. * **Industrial:** Power supplies and embedded system modules. --- ### 4. Part Number Decoder Understanding the ATS naming convention for this specific part: * **ATS:** Advanced Thermal Solutions. * **15:** Refers to the specific series/attachment style. * **F:** Fine pitch fin configuration. * **61:** Specific dimensional code (40x40x10mm). * **C2:** Material/Color code (Blue Anodized). * **R0:** Revision or RoHS compliance status.