The **ATS-15G-08-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It is manufactured by **Advanced Thermal Solutions Inc.** --- ### ## Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (Fin Profile)** | 17.5mm | | **Thermal Resistance** | 14.61°C/W (at 100 LFM) | | **Fin Style** | Fine Pitch (straight fins) | --- ### ## Component Breakdown ### 1. Attachment Mechanism (pushPIN™) The "R0" at the end of the part number indicates the use of the **pushPIN™** system. This consists of a plastic or brass pin and a spring. * **Benefits:** Ensures consistent pressure (clamping force) between the heatsink and the chip, improving thermal transfer. * **Installation:** It requires pre-drilled holes in the PCB (Printed Circuit Board). ### 2. Material and Coating * **Aluminum:** Chosen for its excellent weight-to-thermal-conductivity ratio. * **Blue Anodized Finish:** This is not just for aesthetics; anodizing protects the aluminum from corrosion and slightly improves radiant heat transfer. ### 3. Thermal Interface Material (TIM) Most ATS heatsinks in this series come with **pre-applied Thermal Interface Material** (usually a high-performance phase-change material or grease) on the base to eliminate air gaps between the heatsink and the heat source. ### 4. Airflow Design The **17.5mm height** and fin spacing are optimized for both natural convection (passive cooling) and forced air (fan cooling). In forced-air environments, the thermal resistance drops significantly (e.g., from 14.61°C/W down to approximately 2.10°C/W at 500 LFM). --- ### ## Typical Applications * **CPUs and GPUs:** Small form-factor processors. * **ASICs and FPGAs:** Custom logic chips that generate high heat in telecommunications. * **Power Supplies:** Cooling voltage regulators or power transistors.