The **ATS-15G-33-C2-R0** is a specific electronic cooling component, categorized as a high-performance **Heat Sink**. It is manufactured by **Advanced Thermal Solutions (ATS)** and is part of their "push pin" attachment series. --- ### ## Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Part Number** | ATS-15G-33-C2-R0 | | **Product Type** | Heat Sink | | **Attachment Method** | Push Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 17.78mm | | **Thermal Resistance** | 1.74°C/W (at 200 LFM) | | **Flow Orientation** | Omni-directional (Pin Fin design) | --- ### ## Core Electronic Components & Design #### 1. Pin Fin Geometry Unlike traditional straight-fin heat sinks, this model uses a **Pin Fin** array. This design is highly effective in environments where the direction of airflow is inconsistent or limited, as it allows air to enter the fin field from any angle. #### 2. Material Composition * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer provides increased surface emissivity (improving radiation heat transfer) and corrosion resistance. #### 3. Attachment Mechanism (Push Pin) The "R0" suffix refers to the specific attachment kit included. It uses a **brass or plastic push pin** with a stainless steel spring. This ensures: * **Consistent Pressure:** Maintains a specific "Pre-load" for the thermal interface material (TIM). * **Ease of Assembly:** Quick installation through pre-drilled holes in the PCB. --- ### ## Thermal Performance The efficiency of this part is measured by its ability to dissipate heat into the surrounding air. * **Low Airflow (200 LFM):** ~1.74°C/W. * **High Airflow (800 LFM):** Can drop as low as ~0.70°C/W. This makes it suitable for cooling high-power ICs (Integrated Circuits), BGAs (Ball Grid Arrays), and CPUs in confined networking or telecommunications equipment. --- ### ## Comparison with Similar Models | Feature | ATS-15G-33-C1-R0 | ATS-15G-33-C2-R0 | | :--- | :--- | :--- | | **Thermal Interface** | T766 (Basic) | T412 (Advanced) | | **Application** | Standard Cooling | High Performance / Tight Tolerance |