The **ATS-15G-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for secure attachment to Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table highlights the critical mechanical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) with Compression Spring | | **Thermal Resistance** | 1.88°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Fin Type** | Fine Pitch (straight fins) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Detailed Component Breakdown #### A. The Heat Sink Body The part is fabricated from **Aluminum 6063**, which is the industry standard for heat sinks due to its high thermal conductivity and structural integrity. The **Blue Anodized** coating is not just aesthetic; it increases surface emissivity and protects the aluminum from corrosion. #### B. The Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, the "80" series uses a **Push-Pin and Spring** system: * **Reliability:** It provides consistent pressure (preload) on the component, ensuring the best possible contact with the thermal interface material. * **Vibration Resistance:** Mechanical fasteners are preferred in high-vibration environments compared to thermal tape. * **Hole Pattern:** This specific part requires pre-drilled holes in the PCB to accommodate the brass pins. #### C. Thermal Performance The "C2" designation often refers to the specific performance class and interface material. With a height of **25mm**, this heat sink is designed for mid-to-high profile applications where vertical space is available to allow for significant air convection. --- ### 3. Common Applications This part is typically used to cool high-heat-generating semiconductors, such as: * **FPGAs & ASICs:** High-speed processing chips. * **BGA Packages:** Large surface-mount integrated circuits. * **Power Converters:** High-density power modules that require active or passive airflow. ---