The **ATS-15G-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Active/Passive Cooling) | | **Series** | maxiFLOW™ | | **Material** | Blue Anodized Aluminum | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Thermal Resistance** | 7.29°C/W (at 100 LFM) | | **Fin Style** | Tapered (maxiFLOW Design) | --- ### 2. Key Component Breakdown #### A. The maxiFLOW™ Geometry The "G" in the part number refers to the unique fin geometry. Unlike standard straight-fin heat sinks, maxiFLOW™ features a spread-fin design that increases the surface area while reducing pressure drop. This allows for maximum airflow to reach the center of the heat sink. #### B. pushPIN™ Attachment System The **-R0** suffix indicates the inclusion of the pushPIN™ mounting hardware. This system includes: * **Precision Springs:** Provides the exact required pressure for optimal thermal interface material (TIM) performance. * **Nylon pushPINs:** Provides a secure, tool-free attachment to the PCB through pre-drilled holes. #### C. Thermal Interface Material (TIM) This specific model usually comes pre-applied with **ATS-54**, a high-performance thermal phase-change material or grease. This ensures there are no microscopic air gaps between the heat sink base and the electronic component (die). --- ### 3. Application in Electronics This part is typically used in environments where airflow is directed across the PCB. Because of its 20mm height and 40mm footprint, it is commonly found in: * **Networking Equipment:** Routers and Switches. * **Embedded Systems:** Industrial PCs. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. ---