The **ATS-15G-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal properties: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ HS | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 11.51°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin | | **Dimension (L x W)** | 45mm x 45mm | | **Height** | 20mm | --- ### 2. Key Physical Components The design of this heat sink focuses on maximizing surface area while ensuring secure attachment to the PCB. * **Fins (Cross-Cut Pattern):** This model uses a cross-cut fin design. Unlike straight fins, cross-cut fins allow for multi-directional airflow, making it ideal for systems where the direction of the cooling fan might vary. * **Push-Pin Attachment:** Instead of messy adhesives or simple clips, it uses a spring-loaded push-pin system. This ensures even pressure across the electronic chip, which optimizes thermal transfer. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a "Phase Change" material that melts slightly when the chip gets hot, filling microscopic gaps between the chip and the heat sink. --- ### 3. Thermal Performance Data Performance varies based on the Airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.51 | | 300 (1.5 m/s) | 3.92 | | 500 (2.5 m/s) | 2.31 | | 700 (3.5 m/s) | 1.75 | --- ### 4. Typical Applications This part is commonly found in the following electronic environments: * **Networking Hardware:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and power supplies that require active or passive cooling.