The **ATS-15H-142-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed for high-density electronic cooling. --- ## Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-15H-142-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Thermal Resistance (Unducted)** | 4.70 °C/W @ 100 LFM | | **Pitch** | Fine Pitch | | **Flow Pattern** | Straight-Fin | --- ## Core Electronic & Mechanical Components ### 1. The Heat Sink Body The main body is constructed from **Aluminum**. Aluminum is used because it provides a high strength-to-weight ratio and excellent thermal conductivity, which is essential for drawing heat away from sensitive electronic components like CPUs, GPUs, or MOSFETs. ### 2. pushPIN™ Attachment System Instead of using messy thermal adhesives or complex screws, this part uses the **pushPIN™** system. - **Spring Mechanism:** Provides a precise amount of downward pressure (compression) to ensure maximum contact between the heat sink and the chip. - **Hardware:** Usually paired with brass or plastic pins that snap into pre-drilled holes on the Printed Circuit Board (PCB). ### 3. Thermal Interface Material (TIM) The "R0" at the end of the part number typically denotes the type of Thermal Interface Material pre-applied to the base. - **Purpose:** Fills microscopic air gaps between the heat sink and the electronic component to lower thermal resistance. --- ## Operational Performance The efficiency of this part is measured by its thermal resistance at different airflow rates (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.70 | | 200 (1.0 m/s) | 2.92 | | 300 (1.5 m/s) | 2.47 | | 400 (2.0 m/s) | 2.21 | --- ## Use Case Scenarios * **Embedded Systems:** Cooling processors in compact industrial computers. * **Telecommunications:** Dissipating heat from high-speed data transmission chips. * **Power Supplies:** Managing the temperature of voltage regulators to prevent thermal throttling.