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  • ATS-15H-40-C2-R0

  • AI
    The **ATS-15H-40-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heatsink** from the *maxiFLOW™* series. Below is a detailed breakdown of its specifications and electronic application characteristics. --- ### 1. General Specifications This part is designed to dissipate heat from high-power electronic components such as CPUs, GPUs, FPGAs, or power transistors. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.45°C/W @ 200 LFM | | **Dimensions** | 57mm x 40mm x 15mm | --- ### 2. Physical & Mechanical Data The physical design is optimized for high-density PCB layouts where airflow direction is critical. * **Footprint:** 57mm x 40mm. * **Height:** 15mm (Low profile, suitable for 1U or 2U chassis). * **Fin Style:** The maxiFLOW™ design features a flared fin structure which increases surface area and maximizes airflow intake. * **Attachment:** It uses a **pushPIN™** system which ensures precise pressure (TIM compression) and eliminates the need for messy adhesives. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how efficiently the part moves heat away from the silicon die. Lower values are better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 LFM (1.0 m/s) | 1.45 | | 300 LFM (1.5 m/s) | 1.02 | | 400 LFM (2.0 m/s) | 0.85 | | 500 LFM (2.5 m/s) | 0.75 | --- ### 4. Electronic Application & Compatibility * **TIM (Thermal Interface Material):** This part comes pre-applied with **T766**, a high-performance thermal phase-change material that fills microscopic air gaps between the chip and the heatsink. * **Component Mounting:** Designed to fit standard hole patterns on PCBs. The "R0" suffix denotes compliance with standard RoHS environmental regulations. * **Target Devices:** * Network Switches and Routers. * Industrial Power Supplies. * Embedded Computing Modules. --- ### 5. Part Number Breakdown Understanding the nomenclature helps in selecting variants: ```text ATS - 15 H - 40 - C2 - R0 | | | | | | | | | +-- RoHS Compliant / Revision | | | +------- Color/Finish (Blue Anodized) | | +------------ Width/Size Category | +------------------- Fin Height (15mm) +------------------------- Brand (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What are the specific PCB hole diameters required for the pushPIN™ attachment?
    • ⤷ How does the T766 thermal interface material compare to standard silicone grease?
    • ⤷ Can this heatsink be used in a passive cooling environment without fans?