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  • ATS-15H-53-C2-R0

  • AI
    The **ATS-15H-53-C2-R0** is a specific model of a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Series** | pushPIN™ | | **Thermal Resistance (Flowing)** | 2.32 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 8.54 °C/W | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | --- ### Key Electronic & Mechanical Features #### 1. Thermal Performance The primary "electronic" function of this part is thermal management. It is designed with a **Straight Fin** pattern to maximize surface area. * **Active Cooling:** When used with a fan (airflow), it achieves a low thermal resistance of **2.32 °C/W**, meaning for every watt of heat the chip generates, the temperature rises by only 2.32 degrees Celsius. #### 2. PushPIN™ Attachment System This model uses a specialized mechanical attachment system instead of thermal adhesive: * **Components:** It consists of a brass or plastic pin and a stainless steel spring. * **Benefit:** It provides a precise, consistent pressure (preload) on the electronic component, which improves the performance of the Thermal Interface Material (TIM). #### 3. Material and Conductivity * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Not just for aesthetics; the anodized layer provides a small amount of electrical insulation and increases "emissivity," slightly improving radiant heat transfer. --- ### Physical Dimensions * **Length:** 35.00 mm * **Width:** 35.00 mm * **Height (Fin Height):** 30.00 mm * **Pitch (Hole spacing):** 40.00 mm --- ### Typical Applications This heat sink is commonly found in: * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Network switches and routers. * **Power Electronics:** Cooling MOSFETs or Voltage Regulator Modules (VRMs).
    ✨ Follow-up Questions
    • ⤷How do I calculate the correct hole spacing for this heat sink on a PCB?
    • ⤷ What is the difference between Blue Anodized and Gold Anodized heat sinks?
    • ⤷ What type of Thermal Interface Material is recommended for the pushPIN series?