ATS-15H-53-C2-R0
AI

The **ATS-15H-53-C2-R0** is a specific model of a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
### Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. |
| **Series** | pushPIN™ |
| **Thermal Resistance (Flowing)** | 2.32 °C/W @ 100 LFM |
| **Thermal Resistance (Static)** | 8.54 °C/W |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
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### Key Electronic & Mechanical Features
#### 1. Thermal Performance
The primary "electronic" function of this part is thermal management. It is designed with a **Straight Fin** pattern to maximize surface area.
* **Active Cooling:** When used with a fan (airflow), it achieves a low thermal resistance of **2.32 °C/W**, meaning for every watt of heat the chip generates, the temperature rises by only 2.32 degrees Celsius.
#### 2. PushPIN™ Attachment System
This model uses a specialized mechanical attachment system instead of thermal adhesive:
* **Components:** It consists of a brass or plastic pin and a stainless steel spring.
* **Benefit:** It provides a precise, consistent pressure (preload) on the electronic component, which improves the performance of the Thermal Interface Material (TIM).
#### 3. Material and Conductivity
* **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties.
* **Blue Anodized Finish:** Not just for aesthetics; the anodized layer provides a small amount of electrical insulation and increases "emissivity," slightly improving radiant heat transfer.
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### Physical Dimensions
* **Length:** 35.00 mm
* **Width:** 35.00 mm
* **Height (Fin Height):** 30.00 mm
* **Pitch (Hole spacing):** 40.00 mm
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### Typical Applications
This heat sink is commonly found in:
* **Embedded Systems:** Industrial PCs and controllers.
* **Telecommunications:** Network switches and routers.
* **Power Electronics:** Cooling MOSFETs or Voltage Regulator Modules (VRMs).
- ⤷How do I calculate the correct hole spacing for this heat sink on a PCB?
- ⤷ What is the difference between Blue Anodized and Gold Anodized heat sinks?
- ⤷ What type of Thermal Interface Material is recommended for the pushPIN series?