ATS-15H-80-C2-R0
AI

## Electronic Specifications: ATS-15H-80-C2-R0
The **ATS-15H-80-C2-R0** is a high-performance aluminum heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" component series, designed specifically for cooling electronic components such as integrated circuits (ICs), CPUs, or high-power transistors.
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### 1. Key Technical Specifications
Below are the critical mechanical and thermal parameters for this specific part number:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 1.88 °C/W (@ 100 LFM) |
| **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) |
| **Dimensions (L x W x H)** | 30.00 mm x 30.00 mm x 15.00 mm |
| **Pitch (Pattern)** | 35.00 mm x 35.00 mm |
| **Weight** | ~40 grams |
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### 2. Design and Construction
The "electronic" functionality of this part is passive, relying on surface area and material conductivity to dissipate heat.
* **Fins:** It features a **Straight Fin** design. This is optimized for high-performance airflow environments where air is forced through the fins by a fan.
* **Thermal Interface Material (TIM):** The "-R0" suffix typically indicates that the unit comes pre-applied with a high-performance thermal interface material (like a phase-change pad or thermal grease) to ensure minimum thermal resistance between the component and the sink.
* **Mounting System:** The pushPIN™ system uses a brass or plastic pin with a compressed spring. This ensures a consistent "clamping force" (pressure) on the electronic chip, which is vital for preventing hotspots.
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### 3. Thermal Performance Profile
The effectiveness of the ATS-15H-80-C2-R0 varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 1.88 |
| 200 (1.0 m/s) | 1.45 |
| 400 (2.0 m/s) | 1.15 |
| 600 (3.0 m/s) | 1.01 |
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### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying its role in a circuit assembly:
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **15H:** 15.00 mm Height
* **80:** Series/Specific Fin Designator
* **C2:** Material/Color (Aluminum / Blue Anodized)
* **R0:** Revision / Thermal Interface Material type
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- ⤷
What is the recommended mounting hole diameter for the pushPIN system used in this heat sink?
- ⤷ How does blue anodization affect the thermal performance compared to bare aluminum?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied R0 material?