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  • ATS-15H-80-C2-R0

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    ## Electronic Specifications: ATS-15H-80-C2-R0 The **ATS-15H-80-C2-R0** is a high-performance aluminum heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" component series, designed specifically for cooling electronic components such as integrated circuits (ICs), CPUs, or high-power transistors. --- ### 1. Key Technical Specifications Below are the critical mechanical and thermal parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.88 °C/W (@ 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | | **Dimensions (L x W x H)** | 30.00 mm x 30.00 mm x 15.00 mm | | **Pitch (Pattern)** | 35.00 mm x 35.00 mm | | **Weight** | ~40 grams | --- ### 2. Design and Construction The "electronic" functionality of this part is passive, relying on surface area and material conductivity to dissipate heat. * **Fins:** It features a **Straight Fin** design. This is optimized for high-performance airflow environments where air is forced through the fins by a fan. * **Thermal Interface Material (TIM):** The "-R0" suffix typically indicates that the unit comes pre-applied with a high-performance thermal interface material (like a phase-change pad or thermal grease) to ensure minimum thermal resistance between the component and the sink. * **Mounting System:** The pushPIN™ system uses a brass or plastic pin with a compressed spring. This ensures a consistent "clamping force" (pressure) on the electronic chip, which is vital for preventing hotspots. --- ### 3. Thermal Performance Profile The effectiveness of the ATS-15H-80-C2-R0 varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 1.88 | | 200 (1.0 m/s) | 1.45 | | 400 (2.0 m/s) | 1.15 | | 600 (3.0 m/s) | 1.01 | --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying its role in a circuit assembly: * **ATS:** Advanced Thermal Solutions (Manufacturer) * **15H:** 15.00 mm Height * **80:** Series/Specific Fin Designator * **C2:** Material/Color (Aluminum / Blue Anodized) * **R0:** Revision / Thermal Interface Material type ---
    ✨ Follow-up Questions
    • ⤷ What is the recommended mounting hole diameter for the pushPIN system used in this heat sink?
    • ⤷ How does blue anodization affect the thermal performance compared to bare aluminum?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied R0 material?