The **ATS-16A-85-C2-R0** is a specific part number for a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, designed for cooling electronic components like BGA (Ball Grid Array) chips. --- ## 1. Technical Specifications The following table outlines the mechanical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Black Anodized) | | **Dimensions** | 40.00mm x 40.00mm | | **Height** | 20.00mm | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | 2.01°C/W @ 200 LFM | | **Fin Style** | Straight Fin (Spread Fin design) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Electronic & Mechanical Components ### A. The maxiFLOW™ Fin Geometry The "C2" in the part number indicates a specific fin design. The fins are tapered and spread out to increase surface area while minimizing pressure drop. This is critical for electronic systems where airflow (from fans) is limited. ### B. maxiGRIP™ Attachment System Unlike many heat sinks that require holes in the PCB, this part uses a **plastic frame clip** and a **stainless steel spring clip**. * **Frame Clip:** A plastic border that surrounds the electronic component. * **Spring Clip:** A "steady-force" spring that snaps into the frame, applying constant pressure to the chip for optimal thermal contact. ### C. Thermal Interface Material (TIM) The unit comes with **T766** phase-change material pre-applied to the base. In electronics, the TIM is vital because it fills microscopic air gaps between the heat sink and the silicon die, significantly improving heat transfer efficiency. --- ## 3. Part Number Decoder Understanding the nomenclature helps identify the specific configuration: | Code Segment | Meaning | | :--- | :--- | | **ATS-16** | Series Identification (maxiFLOW / maxiGRIP) | | **A** | Material/Revision code | | **85** | Dimension/Fin Configuration | | **C2** | Performance / Height / Fin Type | | **R0** | RoHS Compliant / Standard Packaging | --- ## 4. Usage Scenarios This part is typically found in high-performance electronics such as: * **Network Switches/Routers:** Cooling ASICs and FPGAs. * **Embedded Systems:** Industrial PCs where space is tight but heat density is high. * **Telecommunications:** Base station hardware where reliability under heat is required.