The **ATS-16A-99-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-power surface-mount devices. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Dimensions** | 45mm x 45mm | | **Height** | 20mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Style** | Straight (Cross-cut) | | **Thermal Resistance** | 11.52°C/W (at 200 LFM) | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Electronic & Mechanical Components The "electronic" functionality of this part is passive, meaning it does not require power to operate but is critical for the thermal management of electronic circuits. #### A. The Heat Sink Body Constructed from **Aluminum (AL6063)**, it features a high fin density to maximize the surface area for heat dissipation. The blue anodized finish provides corrosion resistance and increased emissivity. #### B. Push Pin Mounting System The part number suffix (`-R0`) indicates a specific mounting configuration: * **Brass Push Pins:** Provides a secure, vibration-resistant mechanical connection to the PCB. * **Stainless Steel Springs:** Ensures constant downward pressure (TIM pressure) between the heat sink and the chip to minimize thermal resistance. #### C. Thermal Interface Material (TIM) The base of the heat sink comes pre-applied with **T766 thermal tape**. This eliminates the need for manual application of thermal paste and ensures a reliable bond between the component die and the aluminum base. --- ### 3. Thermal Performance Profile Thermal management efficiency is measured by the drop in temperature per watt of power generated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 11.52 | | 400 (2.0 m/s) | 3.32 | | 600 (3.0 m/s) | 2.50 | --- ### 4. Typical Applications * **Network Switches/Routers:** Cooling high-speed ASICs. * **Embedded Systems:** Industrial PCs where space is limited but heat output is high. * **Power Supplies:** Heat dissipation for MOSFETs or power regulators.