ATS-16B-133-C2-R0
AI

The **ATS-16B-133-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, and FPGAs.
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### ## Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-16B-133-C2-R0 |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ (Brass/Plastic) |
| **Thermal Resistance** | 7.41°C/W (at 1.0 m/s airflow) |
| **Dimensions (L x W x H)** | 70mm x 70mm x 10mm |
| **Mounting Style** | Through-hole (Standard spacing) |
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### ## Key Electronic & Physical Characteristics
#### 1. Heat Sink Design (maxiFLOW™)
This part utilizes a unique **flared fin geometry**. Unlike standard straight-fin heat sinks, the flared fins increase the surface area available for heat transfer while reducing pressure drop. This is critical in dense electronic enclosures where airflow might be restricted.
#### 2. Thermal Interface Material (TIM)
The "C2" suffix in the part number indicates that it comes pre-applied with **ATS-PPS-02** or a similar high-performance Phase Change Material. This ensures that there are no microscopic air gaps between the electronic component and the heat sink, maximizing thermal conductivity.
#### 3. The pushPIN™ Attachment System
The **R0** designation refers to the mounting hardware. It uses a push-button mechanism with a compression spring. This provides:
* **Constant Pressure:** Ensures the heat sink is pressed firmly against the chip for uniform cooling.
* **Ease of Assembly:** Can be installed manually without complex tools.
* **Reliability:** Resistant to high-vibration environments, common in industrial electronics.
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### ## Thermal Performance Data
Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 200 | 1.0 | 7.41 |
| 400 | 2.0 | 3.38 |
| 600 | 3.0 | 2.55 |
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### ## Summary of Part Number Breakdown
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **16B**: Series/Style.
* **133**: Specific dimensions and fin configuration.
* **C2**: Thermal Interface Material type (T766/Phase change).
* **R0**: Finish and hardware configuration (Blue Anodized / pushPIN™).
- ⤷
What is the difference between the C1 and C2 variants for this heat sink?
- ⤷ Can this heat sink be used on BGA or LGA packages?
- ⤷ What is the recommended hole diameter for the pushPIN mounting?