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  • ATS-16B-133-C2-R0

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    The **ATS-16B-133-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ### ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-16B-133-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Brass/Plastic) | | **Thermal Resistance** | 7.41°C/W (at 1.0 m/s airflow) | | **Dimensions (L x W x H)** | 70mm x 70mm x 10mm | | **Mounting Style** | Through-hole (Standard spacing) | --- ### ## Key Electronic & Physical Characteristics #### 1. Heat Sink Design (maxiFLOW™) This part utilizes a unique **flared fin geometry**. Unlike standard straight-fin heat sinks, the flared fins increase the surface area available for heat transfer while reducing pressure drop. This is critical in dense electronic enclosures where airflow might be restricted. #### 2. Thermal Interface Material (TIM) The "C2" suffix in the part number indicates that it comes pre-applied with **ATS-PPS-02** or a similar high-performance Phase Change Material. This ensures that there are no microscopic air gaps between the electronic component and the heat sink, maximizing thermal conductivity. #### 3. The pushPIN™ Attachment System The **R0** designation refers to the mounting hardware. It uses a push-button mechanism with a compression spring. This provides: * **Constant Pressure:** Ensures the heat sink is pressed firmly against the chip for uniform cooling. * **Ease of Assembly:** Can be installed manually without complex tools. * **Reliability:** Resistant to high-vibration environments, common in industrial electronics. --- ### ## Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 7.41 | | 400 | 2.0 | 3.38 | | 600 | 3.0 | 2.55 | --- ### ## Summary of Part Number Breakdown * **ATS**: Manufacturer (Advanced Thermal Solutions). * **16B**: Series/Style. * **133**: Specific dimensions and fin configuration. * **C2**: Thermal Interface Material type (T766/Phase change). * **R0**: Finish and hardware configuration (Blue Anodized / pushPIN™).
    ✨ Follow-up Questions
    • ⤷ What is the difference between the C1 and C2 variants for this heat sink?
    • ⤷ Can this heat sink be used on BGA or LGA packages?
    • ⤷ What is the recommended hole diameter for the pushPIN mounting?