The **ATS-16B-173-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **push-pin** style family of thermal management components designed for cooling integrated circuits (ICs). --- ### Technical Specifications | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Part Number** | ATS-16B-173-C2-R0 | | **Type** | Board Level Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm | | **Thermal Resistance** | 4.72°C/W (@ 100 LFM) | | **Fin Style** | Fine-Pitch (Straight Fin) | --- ### Key Components & Features #### 1. Material and Coating * **Aluminum 6063:** This alloy is chosen for its excellent thermal conductivity and structural integrity. * **Blue Anodized Finish:** The anodized layer provides electrical insulation to prevent short circuits if contact occurs, and it also increases surface emissivity to improve radiant heat transfer. #### 2. Mechanical Design (The "Push-Pin" System) The "16B" series utilizes a spring-loaded push-pin mechanism. This provides: * **Constant Pressure:** Ensures the heat sink remains firmly against the processor, maximizing the efficiency of the Thermal Interface Material (TIM). * **Ease of Assembly:** Can be installed manually or via automated equipment without requiring complex tools. #### 3. Thermal Performance The "173" in the part number corresponds to a specific fin density and height configuration. With a height of 30mm, this unit is designed for systems with vertical space availability. * **High Airflow Efficiency:** The straight fin design is optimized for environments with consistent directional airflow. --- ### Comparison: C1 vs. C2 vs. C3 (Finishes) The suffix **C2** refers specifically to the material and finish of the attachment hardware: | Suffix | Attachment Material | Thermal Interface | |:---:|:---|:---| | **C1** | Blue Anodized | No TIM / Standard | | **C2** | **Blue Anodized** | **Enhanced Performance** | | **C3** | Blue Anodized | Phase Change Material | --- ### Usage Recommendations * **Application:** Ideal for BGA (Ball Grid Array) components, CPUs, or GPUs in networking equipment, telecommunications, and industrial computers. * **Mounting:** Ensure the PCB has the pre-drilled holes required for the specific push-pin pitch of this 30mm x 30mm footprint.