The **ATS-16B-176-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat-generating integrated circuits. --- ### 1. Technical Specifications The part number provides specific details about its physical and thermal characteristics: | Property | Details | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Type** | Straight Fin | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Mounting Style** | pushPIN™ (Spring Loaded) | | **Attachment Type** | Plastic Push Pin | | **Thermal Resistance** | 4.40°C/W (at 1.0 m/s airflow) | --- ### 2. Breakdown of the Part Number Advanced Thermal Solutions uses a structured naming convention: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **16**: Series identifier. * **B**: Revision or specific designator. * **176**: Unique identifier for the specific fin pattern and size. * **C2**: Indicates the material/finish (typically Aluminum with a specific thermal performance). * **R0**: Versioning (RoHS compliance status or design revision). --- ### 3. Key Electronic Cooling Features #### Thermal Interface Material (TIM) The "C2" variant typically comes with a pre-applied **Phase Change Material** or high-performance thermal pad. This ensures that the air gaps between the electronic component (die) and the heat sink are filled, significantly reducing thermal resistance. #### Mounting Mechanism: pushPIN™ Instead of using messy adhesives or heavy brackets, this part uses a spring-loaded push-pin system. This provides: 1. **Uniform Pressure:** Ensures the heat sink is pressed evenly against the electronic chip. 2. **Reliability:** Resistant to vibration and mechanical shock. 3. **Ease of Assembly:** Can be installed quickly on a PCB with pre-drilled holes. #### Fin Design The **Straight Fin** geometry is optimized for "open-flow" environments where a fan or chassis airflow can pass through the fins easily, carrying heat away from the sensitive electronic substrate. ---