The **ATS-16B-28-C2-R0** is a specific electronic component belonging to the thermal management category. It is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its specifications and electronic application characteristics. --- ### 1. General Specifications This part belongs to the **pushPIN™** Heat Sink Assembly series, designed for easy mounting and consistent pressure on the component being cooled. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-16B-28-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Mounting Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 10.62°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Physical Dimensions The physical dimensions determine which electronic packages (like BGA, FPGA, or CPU) the heat sink can be applied to. | Dimension | Value (mm) | Description | | :--- | :--- | :--- | | **Length (A)** | 40.00 mm | Horizontal base length | | **Width (B)** | 40.00 mm | Vertical base width | | **Height (C)** | 15.00 mm | Fin height from the base | | **Pitch (E)** | 33.00 mm | Distance between mounting holes | | **Pitch (F)** | 33.00 mm | Distance between mounting holes | --- ### 3. Thermal Performance The efficiency of this heat sink depends on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure. * **Low Airflow (100 LFM):** 10.62 °C/W * **Medium Airflow (400 LFM):** 2.70 °C/W * **High Airflow (700 LFM):** 1.94 °C/W *Note: A lower °C/W rating indicates better heat dissipation efficiency.* --- ### 4. Component Features * **Fin Design:** It utilizes a **Fine-Pitch** pattern, which increases the surface area for heat exchange, making it ideal for compact electronic spaces with high heat density. * **Attachment:** The `pushPIN™` mechanism uses a brass component and a stainless steel spring. This provides a precise "snap-fit" that ensures the thermal interface material (TIM) is compressed evenly across the chip. * **Thermal Interface Material:** This specific model typically comes pre-applied with **T766** thermal phase change material or grease, ensuring immediate thermal conductivity upon installation. * **Compliance:** Fully **RoHS-6** and **REACH** compliant, meeting environmental safety standards for global electronic manufacturing. --- ### 5. Common Applications This heat sink is typically found in: * **Telecommunications:** Cooling of high-speed networking chips. * **Computing:** Protecting GPUs or VRMs on motherboards. * **Industrial Power Supplies:** Managing heat in power conversion modules.